The growth of AI is hampered by computational power. Increasing demands for AI to become ever more powerful and ever more accessible have placed a requirement for there to be ever more powerful computer chips. However, increasingly powerful chips produce more heat, making cooling a key bottleneck.
The early versions of OpenAI’s ChatGPT were trained on NVIDIA chips, which used 400W of power. However, only 4 years later, new GPUs and AI accelerators are already looking to increase the power requirements by 10x, which requires liquid cooling. NVIDIA’s recent adoption of liquid cooling for its latest generations of data centre GPUs has highlighted this key demand.
Coming out of stealth mode, semiconductor cooling startup Corintis has today announced that it has raised a $24M Series A to address this problem. The round was led by BlueYard Capital with participation from Founderful, Acequia Capital, Celsius Industries, XTX Ventures, among others. Corintis also announces that it will be opening multiple US offices to better serve its American customers in addition to an Engineering office in Munich, Germany.
To date, the company has raised $33.4M in total. Instead of facing AI off against computational requirements, their technology embraces AI to help cool computer chips more effectively. As part of this funding, Chairman of Walden International and Intel CEO Lip-Bu Tan has joined as a board director and investor prior to becoming Intel CEO, in addition to Geoff Lyon (former CEO & Founder of CoolIT), also joining the board. With this addition to the board, Corintis doubles down on building a bridge between the worlds of semiconductor design, manufacturing, and chip-cooling.
Corintis’s technology focuses on microfluidic cooling: Optimised micro-scale liquid cooling for computer chips in data centres, which are used for advanced computation, including for generative AI. In addition to having several major American tech giants as customers, the company already enjoys a partnership with Microsoft to help bring this cutting-edge technology to the real world. Earlier this week, Microsoft announced that in collaboration with Corintis, it has successfully achieved a breakthrough by developing an in-chip microfluidic cooling system that can effectively cool a server running core services. Tests showed that microfluidic cooling embedded inside the chip removed heat a staggering three times better than the most advanced technology commonly used today.
Based on research conducted at the Federal Institute of Technology in Lausanne (EPFL) in Switzerland, Corintis was co-founded by Dr Remco van Erp (CEO), Sam Harrison (COO) & Prof Elison Matioli (Scientific Adviser).
Corintis’ solution relies on two main elements to achieve its mission of 10x better cooling: Firstly, “co-designed microfluidic cooling”. Corintis develops best-in-class simulation and optimization software and new manufacturing methods to design micro-scale optimized liquid cooling, or Microfluidic cooling, that is adapted to the chip to bring the right liquid to the right location. This can be supplied as either a drop-in replacement to any liquid cooling system today, or integrated together with the chip, as “co-packaged cooling”, to reach up to an order of magnitude increase in cooling performance. Their technology also enables data centers to reduce their water consumption, a key ecological concern of AI technologies.
Corintis’ platform builds a bridge between chip and cooling design, enabling chip designers to build the next generation of AI chips with superior thermal performance. The technology platforms the company has already developed include Glacierware, to help automate the design of cooling systems, a copper microfluidic manufacturing facility to manufacture cold plates with features as small as a human hair in high volume, and its Therminator platform, allowing chip companies to physically emulate next-gen chips with millimetre accuracy on silicon test chips before production to validate their cooling solution ahead of time.
The company has already manufactured over ten thousand cooling systems, with deployments running in data centers on leading-edge AI chips. It has already achieved 8-digit cumulative revenue since its incorporation. It is on track to more than 10x this with its early deployments. With new funding, the company looks to scale its already sizable team of 55 employees today to over 70 by the end of the year, and ramp up its manufacturing footprint even further, aiming to achieve a capacity exceeding a million microfluidic cold plates annually during 2026. With this scale, Corintis is ready to play a decisive role in the advancement of computational and AI power.
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This entry was posted on September 25, 2025 at 2:03 pm and is filed under Commentary with tags Corintis. You can follow any responses to this entry through the RSS 2.0 feed.
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Corintis raises $24M to target the next AI bottleneck, and collaborates with Microsoft for chip cooling breakthrough
The growth of AI is hampered by computational power. Increasing demands for AI to become ever more powerful and ever more accessible have placed a requirement for there to be ever more powerful computer chips. However, increasingly powerful chips produce more heat, making cooling a key bottleneck.
The early versions of OpenAI’s ChatGPT were trained on NVIDIA chips, which used 400W of power. However, only 4 years later, new GPUs and AI accelerators are already looking to increase the power requirements by 10x, which requires liquid cooling. NVIDIA’s recent adoption of liquid cooling for its latest generations of data centre GPUs has highlighted this key demand.
Coming out of stealth mode, semiconductor cooling startup Corintis has today announced that it has raised a $24M Series A to address this problem. The round was led by BlueYard Capital with participation from Founderful, Acequia Capital, Celsius Industries, XTX Ventures, among others. Corintis also announces that it will be opening multiple US offices to better serve its American customers in addition to an Engineering office in Munich, Germany.
To date, the company has raised $33.4M in total. Instead of facing AI off against computational requirements, their technology embraces AI to help cool computer chips more effectively. As part of this funding, Chairman of Walden International and Intel CEO Lip-Bu Tan has joined as a board director and investor prior to becoming Intel CEO, in addition to Geoff Lyon (former CEO & Founder of CoolIT), also joining the board. With this addition to the board, Corintis doubles down on building a bridge between the worlds of semiconductor design, manufacturing, and chip-cooling.
Corintis’s technology focuses on microfluidic cooling: Optimised micro-scale liquid cooling for computer chips in data centres, which are used for advanced computation, including for generative AI. In addition to having several major American tech giants as customers, the company already enjoys a partnership with Microsoft to help bring this cutting-edge technology to the real world. Earlier this week, Microsoft announced that in collaboration with Corintis, it has successfully achieved a breakthrough by developing an in-chip microfluidic cooling system that can effectively cool a server running core services. Tests showed that microfluidic cooling embedded inside the chip removed heat a staggering three times better than the most advanced technology commonly used today.
Based on research conducted at the Federal Institute of Technology in Lausanne (EPFL) in Switzerland, Corintis was co-founded by Dr Remco van Erp (CEO), Sam Harrison (COO) & Prof Elison Matioli (Scientific Adviser).
Corintis’ solution relies on two main elements to achieve its mission of 10x better cooling: Firstly, “co-designed microfluidic cooling”. Corintis develops best-in-class simulation and optimization software and new manufacturing methods to design micro-scale optimized liquid cooling, or Microfluidic cooling, that is adapted to the chip to bring the right liquid to the right location. This can be supplied as either a drop-in replacement to any liquid cooling system today, or integrated together with the chip, as “co-packaged cooling”, to reach up to an order of magnitude increase in cooling performance. Their technology also enables data centers to reduce their water consumption, a key ecological concern of AI technologies.
Corintis’ platform builds a bridge between chip and cooling design, enabling chip designers to build the next generation of AI chips with superior thermal performance. The technology platforms the company has already developed include Glacierware, to help automate the design of cooling systems, a copper microfluidic manufacturing facility to manufacture cold plates with features as small as a human hair in high volume, and its Therminator platform, allowing chip companies to physically emulate next-gen chips with millimetre accuracy on silicon test chips before production to validate their cooling solution ahead of time.
The company has already manufactured over ten thousand cooling systems, with deployments running in data centers on leading-edge AI chips. It has already achieved 8-digit cumulative revenue since its incorporation. It is on track to more than 10x this with its early deployments. With new funding, the company looks to scale its already sizable team of 55 employees today to over 70 by the end of the year, and ramp up its manufacturing footprint even further, aiming to achieve a capacity exceeding a million microfluidic cold plates annually during 2026. With this scale, Corintis is ready to play a decisive role in the advancement of computational and AI power.
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This entry was posted on September 25, 2025 at 2:03 pm and is filed under Commentary with tags Corintis. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.