Hyper® today announced the launch of the HyperDrive® Next USB4 V2 M.2 PCIe Enclosure. A CES® Innovation Awards 2026 Honoree, this next-generation expansion solution delivers 80Gbps USB4 V2 connection for high-speed storage and modular PCIe expansion.
Designed for creators, engineers, and professionals who require fast and reliable data transfer, the enclosure enables full PCIe Gen4 NVMe performance, supports AI-focused PCIe M.2 modules, and features tool-free installation with IP55 dust and water resistance for demanding field or travel environments.
Engineered for Speed, Expansion, and Durability
The HyperDrive Next USB4 V2 M.2 PCIe Enclosure delivers true PCIe Gen4 x4 performance via an 80Gbps USB4 V2 connection, enabling faster workflows for content creation, data science, AI development, and high-volume file transfers.
Its modular design supports PCIe M.2 components such as AI accelerators, allowing users to augment system performance without upgrading their entire laptop or workstation.
A precision-machined aluminum body provides passive thermal cooling, while the included silicone sleeve delivers IP55-rated dust and water protection—ideal for studio, office, or field applications. And with its tool-free snap-in installation, users can swap SSDs or PCIe modules in seconds.
Features
- 80Gbps USB4 V2 Performance: Experience next-generation bandwidth with true PCIe Gen4/3 NVMe speed for demanding workflows including 4K/8K editing, AI model inference, and rapid data transfer.
- Full PCIe Gen4/3 NVMe Compatibility: Unlock the full potential of PCIe Gen4 and Gen3 NVMe SSDs for maximum throughput and workstation-level responsiveness.
- Modular PCIe Expansion: Supports PCIe M.2 cards such as AI accelerators for enhanced local computer performance without upgrading your laptop or desktop system.
- External Power Support: Provides up to 18W of optional external USB-C power-in to support high-performance NVMe SSDs. When combined with up to 7.5W supplied by the host USB-C port, the enclosure delivers a total of up to 25W of power, suitable for high-draw NVMe devices as recommended by our supplier.
- Tool-Free Installation: Open, insert, and close—no screws required, this enclosure is ideal for dynamic workflows with multiple SSDs or PCIe modules.
- Premium Thermal Design: Aluminum body with an integrated thermal pad keeps drives running at peak speed under heavy load.
- IP55 Protection: The included silicone sleeve shields the enclosure from dust and water spray—built for use in studios, labs, and field environments.
Availability and Pricing
The HyperDrive Next USB4 V2 M.2 PCIe Enclosure (HD2500GL) is available starting today for $199.99 SRP throughout the United States, Europe, and other key global regions.
Hyper Showcases Award-WinningPower and Connectivity Solutions at CES2026
Posted in Commentary with tags Hyper on January 5, 2026 by itnerdHyper introduced its 2026 product lineup at CES, led by two CES Innovation Awards® 2026 Honorees, the HyperDrive® Next USB4 M.2 PCIe Enclosure and HyperSpace™ Trackpad Pro.
Alongside these award-winning products, the lineup includes solid-state power banks for safe charging, next-gen GaN charging solutions, and high-performance connectivity products designed for modern devices and workflows. The full product range will be on display at CES 2026, January 6-9 in Las Vegas.
Hyper’s 2026 Featured Products
CES Innovation Awards® 2026 Honoree for External Expansion and Workstation-Class Performance, anywhere.
The HyperDrive Next USB4 M.2 PCIe Enclosure delivers true PCIe Gen 4 x4 performance over USB4 v2 (up to 64Gbps), enabling creators to run ultrafast NVMe SSDs, external AI accelerators, and other high-performance PCIe modules – all without requiring internal device upgrades. It features a tool-free snap-in design, optional 25W hybrid power for high-performance workflows, and a premium chassis made from 100% recycled aluminum.
HyperJuice® Solid State Power Banks (New for 2026)
Next generation mobile power built for safety, speed, and travel
Hyper’s new solid state power banks in 5,000mAh and 10,000mAh capacities are designed to run cooler and charge more safely than traditional lithium-ion batteries. With Qi2/Qi2.2 magnetic fast charging (15W–25W), 20W–30W USBC input, and MagSafe-compatible alignment, these compact power banks deliver reliable, airline-safe charging while on the move.
HyperDrive® Next USB-C Hubs and Thunderbolt® 5 Dock (New for 2026)
High-performance connectivity with streamlined single-cable workflows
The HyperDrive Next lineup delivers streamlined connectivity for modern workspaces, including USB-C hubs with direct 4K60Hz display support and 10Gbps data transfer, plus a Thunderbolt 5 dock with Thunderbolt™ Share for high-bandwidth, multi-display, and high-power single-cable setups. Built with recycled aluminum and plastics, the lineup combines durable design with high-performance connectivity.
HyperSpace® Trackpad Pro
CES Innovation Awards 2026 Honoree – the most advanced haptic trackpad for Windows®
The HyperSpace Trackpad Pro is the first premium haptic trackpad designed specifically for Windows, delivering zero latency input, a 240Hz report rate, and independent pressure sensing for up to 10 fingers. Paired with Hydra® Connect software, users can create app-specific shortcuts, gesture zones, and deep click profiles for unparalleled precision and customization. It finally brings the high-performance trackpad experience Windows creators have been waiting for.
See Hyper’s Innovations at CES 2026
Consumers, media, and industry professionals can experience Hyper’s award winning products firsthand at CES 2026, taking place January 6–9 in Las Vegas. Hyper will showcase its latest innovations alongside parent company Targus® in Exhibition Suite #35-106 at The Venetian.
Both CES Innovation Awards honorees will be featured in the Innovation Awards Showcase and highlighted during CES Unveiled, the premier media preview event held at the Mandalay Bay Convention Center on the evening of January 4.
Leave a comment »